| 摘要 |
PROBLEM TO BE SOLVED: To provide a technique capable of reducing the thickness of a semiconductor device. SOLUTION: The semiconductor device has a configuration made up of a semiconductor element, leads arranged at both sides of the semiconductor element so as to sandwich the element, wires for connecting one of the surfaces of each lead and an electrode of the semiconductor element corresponding thereto, and a resin for sealing the semiconductor element, the wires, and the leads, in which the undersurface of the semiconductor element and the other surface of each lead are arranged substantially in the same plane and exposed from the sealing resin. COPYRIGHT: (C)2004,JPO
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