发明名称 |
Oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition |
摘要 |
An oxygen-removing pre-process for copper interconnect grown by electrochemical displacement deposition is to remove the oxygen in the reaction solution before displacement and deposition a copper film/conducting wire such that the copper film/conducting wire is grown and has a lower electric resistance.
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申请公布号 |
US2004108221(A1) |
申请公布日期 |
2004.06.10 |
申请号 |
US20030716550 |
申请日期 |
2003.11.20 |
申请人 |
LIU DON-GEY;YANG TSONG-JEN;YANG CHIN-HAO;YANG WEN LUH;CHEN GIIN-SHAN |
发明人 |
LIU DON-GEY;YANG TSONG-JEN;YANG CHIN-HAO;YANG WEN LUH;CHEN GIIN-SHAN |
分类号 |
C23C18/16;C23C18/38;(IPC1-7):C25C1/12 |
主分类号 |
C23C18/16 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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