发明名称 |
RESIN BOARD FOR FLOOR BACKING MATERIAL, AND DOUBLE FLOOR USING THE SAME |
摘要 |
PROBLEM TO BE SOLVED: To provide a resin board for a floor backing material, and a double floor using the resin board positively integrated with a laminated object only with an adhesive even if using the floor backing material formed of a synthetic resin material not easily bonded to a leveling plate or the like used as the laminated object. SOLUTION: This resin board 1 for the floor backing material is used between the other floor constituting material 10 and a floor base 20 and integrated with the laminated object with the adhesive 8. The board 1 has at least an outer skin 1A formed of a synthetic resin material, and an adhesive layer 1B physically jointed to the outer skin 1A is formed on the upper face of the skin 1A. A finishing material 3 is laminated on the upper face of the adhesive layer 1B through the leveling plate 2 formed of a wood material, to use the board 1 as the double floor. It is preferable to form the outer skin 1A of polypropylene, to form the adhesive layer 1B of a fiber material and to form the adhesive 8 of a vinyl acetate adhesive or a urethane adhesive. COPYRIGHT: (C)2004,JPO
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申请公布号 |
JP2004162408(A) |
申请公布日期 |
2004.06.10 |
申请号 |
JP20020330346 |
申请日期 |
2002.11.14 |
申请人 |
BRIDGESTONE CORP;ARACO CORP |
发明人 |
YAMAKAWA MASABUMI;TANI NORISHIGE;AOYAMA MITSUHARU;YANASE KAZUSHI |
分类号 |
E04F15/02;(IPC1-7):E04F15/02 |
主分类号 |
E04F15/02 |
代理机构 |
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