| 摘要 |
PROBLEM TO BE SOLVED: To choose a defect with high possibility that may be regarded as electric inferiority in inspection of a foreign matter or a patter defect of an electronic device of a semiconductor integrated circuit or the like. SOLUTION: An inspection state processing program reads out wafer information from a wafer (step 1), reads out inspection result data (step 2), reads out a layout file name and a mask name from mask corresponding data (step 3), and reads out corresponding inferiority probability data (step 4). The program corrects defect size and calculates inferiority probability for each mask (step 5-10). Furthermore, the program calculates review priority of each defect from the inferiority probability of each mask (step 11), and writes the result into inspection data (step 12). Furthermore, the program reads out review condition data (step 13), and chooses a review part satisfying a review condition (step 14). COPYRIGHT: (C)2004,JPO
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