发明名称 Method for fabricating semiconductor light-emitting device
摘要 An n-type buffer layer composed of n-type GaN, an n-type cladding layer composed of n-type AlGaN, an n-type optical confinement layer composed of n-type GaN, a single quantum well active layer composed of undoped GaInN, a p-type optical confinement layer composed of p-type GaN, a p-type cladding layer composed of p-type AlGaN, and a p-type contact layer composed of p-type GaN are formed on a substrate composed of sapphire. A current blocking layer formed in an upper portion of the p-type cladding layer and on both sides of the p-type contact layer to define a ridge portion is composed of a dielectric material obtained by replacing some of nitrogen atoms composing a Group III-V nitride semiconductor with oxygen atoms.
申请公布号 US6746948(B2) 申请公布日期 2004.06.08
申请号 US20020243711 申请日期 2002.09.16
申请人 MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. 发明人 UEDA DAISUKE;TAKIGAWA SHINICHI
分类号 H01L33/14;H01L33/32;H01S5/22;H01S5/343;(IPC1-7):H01L21/28 主分类号 H01L33/14
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