ENHANCED HIGH-FREQUENCY VIA INTERCONNECTION FOR IMPROVED MECHANICAL/ELECTRIC RELIABILITY OF FEATURE MOUNTED ON SURFACE

摘要

PURPOSE: An enhanced high-frequency via interconnection for improving reliability is provided to reduce a leakage and a parasite capacitance of a multi-layer ceramic substrate during a high-frequency operation by reducing the number of vias related to an interlayer connector. CONSTITUTION: A plurality of ceramic layers includes conductors thereon. The ceramic layers include a first outer layer(12) and a second layer(16) adjacent to the first outer layer. Each of the first outer layer and the second layer has a center location. A plurality of vias(14) are extended from the first outer layer to the second layer. A plurality of metal straps correspond to the vias and contact the vias. The first outer layer includes a plurality of contact pads, each of which is electrically connected to a portion of the vias. Each of the metallic straps connects to a single via(18), such that each of the portion of the vias is electrically connected to the single via of the metallic strap.