THERMAL-CONDUCTIVE SILICONE COMPOSITION AND MOLDED PRODUCT USING THE SAME

摘要

PURPOSE: Provided are a thermal-conductive silicone composition having flow property and easily and continuously forming a molded product and a non-elastic molded product. CONSTITUTION: The thermal-conductive silicone composition comprises (a) 100 weight parts of organo-polysiloxane having alkenyl groups on both ends of a branched chain; (b) 200 to 3000 weight parts of a thermal-conductive filler; (c) organo-hydrogen polysiloxane having a Si-H group on both ends of the branched chain in the amount of 0.1 to 5 times of alkenyl groups by moles among the components (a) in terms of moles of hydrogen directly bonded to silicone atoms; and (d) platinum based curing catalyst in the amount of 0.1 to 500 ppm in terms of a platinum element based to the component(a).