发明名称 APPARATUS FOR INSPECTING DEFECT ON REAR SURFACE OF WAFER AND SEMICONDUCTOR FABRICATING METHOD USING THE SAME
摘要 PURPOSE: An apparatus for inspecting a defect on the rear surface of a wafer is provided to prevent a local hunting phenomenon and perform the maintenance process on semiconductor fabricating equipment by inspecting whether a defect exists on the rear surface of the wafer before a wafer coated with a photoresist layer is loaded into an exposure apparatus. CONSTITUTION: A wafer holding unit(110) holds a wafer to inspect whether a defect exists on the wafer. A defect detecting unit(120) inspects whether a defect exists on the rear surface of the wafer. A display unit(140) displays whether a defect is detected from the defect detecting unit. A control unit(130) controls the operation of the wafer holding unit, the defect detecting unit and the display unit.
申请公布号 KR20040047466(A) 申请公布日期 2004.06.05
申请号 KR20020075698 申请日期 2002.11.30
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 JUNG, IN SUK
分类号 H01L21/027;(IPC1-7):H01L21/027 主分类号 H01L21/027
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