发明名称 |
APPARATUS FOR INSPECTING DEFECT ON REAR SURFACE OF WAFER AND SEMICONDUCTOR FABRICATING METHOD USING THE SAME |
摘要 |
PURPOSE: An apparatus for inspecting a defect on the rear surface of a wafer is provided to prevent a local hunting phenomenon and perform the maintenance process on semiconductor fabricating equipment by inspecting whether a defect exists on the rear surface of the wafer before a wafer coated with a photoresist layer is loaded into an exposure apparatus. CONSTITUTION: A wafer holding unit(110) holds a wafer to inspect whether a defect exists on the wafer. A defect detecting unit(120) inspects whether a defect exists on the rear surface of the wafer. A display unit(140) displays whether a defect is detected from the defect detecting unit. A control unit(130) controls the operation of the wafer holding unit, the defect detecting unit and the display unit.
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申请公布号 |
KR20040047466(A) |
申请公布日期 |
2004.06.05 |
申请号 |
KR20020075698 |
申请日期 |
2002.11.30 |
申请人 |
SAMSUNG ELECTRONICS CO., LTD. |
发明人 |
JUNG, IN SUK |
分类号 |
H01L21/027;(IPC1-7):H01L21/027 |
主分类号 |
H01L21/027 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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