| 摘要 |
PURPOSE: A structure for assembling the radiating fins of an electronic chip cooling device is provided to maximize a flowing volume of cooling fluid by making an assembly structure of the radiating fins as a flexible structure. CONSTITUTION: A terminal base(110) directly contacts to a heating element. The first and the second heat pipes(120,130) are soldered to an upper part of the terminal base. At an end of the heat pipes, the first and the second radiating blocks(140,150) are formed by the radiating fins(141,151). A fan motor(160) forcibly circulates cooling fluid to the radiating blocks. A base frame fixes the fan motor. A fan cover efficiently flows in/out the cooling fluid by isolating a large portion except an upper center of a fan motor installing part. The respective radiating fins forming the radiating block respectively vary an installing angle flexibly depending on the flow of the cooling fluid.
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