TEST METHOD OF SEMICONDUCTOR INTEGRATED CIRCUIT, PROBE CARD, SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR INTEGRATED CIRCUIT DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a test method of a semiconductor integrated circuit device, a probe card and a semiconductor integrated circuit device wherein capacity magnification of an LSI tester is realized, and a method for manufacturing the semiconductor integrated circuit device. SOLUTION: A test jig provided with a test signal processing circuit is installed between a semiconductor integrated circuit test device and a semiconductor integrated circuit for test. A compressed first test signal is generated in the test device and delivered to the test jig. The first test signal is extended by the test signal processing circuit of the test jig and a second test signal is output to the semiconductor integrated circuit for test. A response signal from the semiconductor integrated circuit for test is compressed and output to the semiconductor integrated circuit test device, thereby performing test. COPYRIGHT: (C)2004,JPO