| 摘要 |
PROBLEM TO BE SOLVED: To provide a resin paste for a semiconductor that is curable in a short time, has high adhesive strength when heated and has characteristics excellent in low modulus of elasticity when heated and that contains a small amount of ionic impurities. SOLUTION: The resin paste for the semiconductor comprises as the essential components (A) an epoxy resin containing 5wt.% or more epoxy resin having a hydrolyzable chlorine content of 1,000ppm or less and represented by formula (1), based on the total epoxy resin. (B) an imidazole compound having a melting point of 100°C or more, (C) a curing agent comprising a phenolic resin having two or more active hydrogen groups per molecule and (D) a filler wherein a ratio of (B)/(C) (a weight ratio of the component (B) to the component (C) based on 100pts.wt. epoxy resin) is (0.1-20)/(0.5-50). In formula (1), each of R<SB>1</SB>is a hydrogen atom or a 1-6C alkyl group, which may be the same or different; and n is an average value which is a positive number of 0-3. COPYRIGHT: (C)2004,JPO
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