| 摘要 |
<HEADING LVL="1">SUMMARY An element, such as a Printed Wired Board (PWB) or Printed Circuit Board (PCB) is provided with elongated lower-stiffness areas, which provide the element with areas obtaining a lower deformation during deformation of the element, such as during a fall thereof. Fragile or large electronic or electrical parts, such as Integrated Circuits (IC), such as Ball Grid Arrays (BGA) are positioned the lower deformation areas in order to maintain electrical connection to the element during and after the deformation of the element.
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