| 发明名称 |
LIGHT EMITTING DIODE WITH ADHESIVE LAYER AND MANUFACTURING METHOD THEREOF |
| 摘要 |
<P>PROBLEM TO BE SOLVED: To develop a light emitting diode with a strong structure. <P>SOLUTION: A method for forming a light emitting diode includes steps of: forming a first stack; forming a second reaction layer on the first stack; forming a second stack; forming a first reaction layer on the second stack; and holding together the first reaction layer and the second reaction layer by means of a transparent adhesive layer. The transparent adhesive layer is formed between the first and second reaction layers, and therefore the second reaction layer of the first stack does not come off the first reaction layer of the second stack. <P>COPYRIGHT: (C)2004,JPO |
| 申请公布号 |
JP2004158823(A) |
申请公布日期 |
2004.06.03 |
| 申请号 |
JP20030197103 |
申请日期 |
2003.07.15 |
| 申请人 |
SHOGEN KODEN KOFUN YUGENKOSHI |
发明人 |
LIU WEN-HUANG;TZENG TZ-FENG;SHA MEIKUN;YE DING-WEI;WANG REN-SHUEI |
| 分类号 |
H01L33/30;H01L33/34;H01L33/42 |
主分类号 |
H01L33/30 |
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