| 摘要 |
In a lead-frame configuration ( 60 ), a module ( 70 ) and a data carrier ( 72 ), two connecting plates ( 12, 13 ) of the module ( 70 ), which are each intended for connection to a connecting contact or bump ( 47, 48 ) of a chip ( 41 ), are connected to a reinforcement film ( 66, 71 ) formed from a fiber-reinforced film of plastics material by means of a layer ( 73 ) of an adhesive that is particularly well suited to transmitting shear forces, in which case there is additionally provided in an advantageous further embodiment, on the reinforcement film ( 66, 71 ), at least one further layer ( 74, 75, 76 ) that is able to serve for protecting, damping or fastening purposes. |
