发明名称 |
METHOD AND SYSTEM FOR MANUFACTURING SEMICONDUCTOR DEVICE |
摘要 |
PROBLEM TO BE SOLVED: To provide a method and a system by which a semiconductor device can be manufactured by making the high-speed evaluation of the manufacturing process of a hyperfine actual circuit pattern possible by utilizing a three-dimensional measuring technique using an optical scatterometric instrument. SOLUTION: In the method, the product of the semiconductor device is manufactured by forming a test pattern and an actual circuit pattern through a prescribed semiconductor manufacturing process. The semiconductor manufacturing process is evaluated with respect to the actual circuit pattern of the product by measuring the feature of the three-dimensional form of the test pattern formed in the product by using the optical scatterometric instrument. COPYRIGHT: (C)2004,JPO |
申请公布号 |
JP2004158478(A) |
申请公布日期 |
2004.06.03 |
申请号 |
JP20020319833 |
申请日期 |
2002.11.01 |
申请人 |
HITACHI HIGH-TECHNOLOGIES CORP |
发明人 |
NAKAGAKI AKIRA;WATANABE KENJI;TOYOSHIMA YUYA;SHISHIDO CHIE;TAKAGI YUJI;TANAKA MAKI |
分类号 |
G03F7/20;H01L21/027;H01L21/3205;H01L21/66;H01L23/544;(IPC1-7):H01L21/027;H01L21/320 |
主分类号 |
G03F7/20 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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