METHOD OF MANUFACTURING SUBSTRATE FOR POWER MODULE

摘要

PROBLEM TO BE SOLVED: To provide a method of manufacturing a substrate for a power module in which a failure occurring in a manufacturing process such as a crack of a sintered body can be controlled and an insulated substrate can be formed with higher accuracy at the time of forming an oxide layer on the surface of the sintered body. SOLUTION: In the method of manufacturing the substrate 1 for the power module in which a circuit layer 3 or a heat sink 4 is provided on the front surface side or the rear surface side of the insulated substrate 2, a sintered body 2a is formed by sintering a powder material at the time of forming the insulated substrate 2. Thereafter, the surface of the sintered body 2a is polished and then an oxide layer 2b is formed on the polished surface. COPYRIGHT: (C)2004,JPO