发明名称 Arrangement for electromagnetic radiation reduction and arresting overvoltages
摘要 The device has a solder stop foil (3) applied to at least one conductive region (2) of the printed circuit board (1), the opposite side of the solder stop foil to the printed circuit board is coated with a conductive material for providing a surface element (4) in the form of a conductor path which can be connected to an earth potential (8), e.g. via a screw connection (5). An Independent claim for a solder stop foil is also included.
申请公布号 EP1424883(A2) 申请公布日期 2004.06.02
申请号 EP20030104000 申请日期 2003.10.29
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 REINHARDT, JOERG
分类号 H05K1/02;H05K3/46;H05K9/00;(IPC1-7):H05K9/00;H01T4/08 主分类号 H05K1/02
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