Process of removing semiconductor chips from a film and apparatus therefor

摘要

The method involves lowering a chip gripper (2) of a bondhead (1) to a position z0 that is greater than an average height of a semiconductor chip (19) surface, so that the gripper does not yet touch the chip. Needle (14) is raised to a preset position Z1 to bring the chip into contact with the gripper and then to increase the z position of the gripper. The chip detaches itself from the needle upon raising the gripper.