发明名称 Electronic apparatus
摘要 The invention provides an electronic apparatus having a metal core substrate including a metal plate, an insulating layer formed on the metal plate and a conductive layer formed on the insulating layer, and an electronic part, and to which the conductive layer and a terminal of the electronic part are connected. In the electronic apparatus, a member having a high thermal conductivity is arranged so as to be in contact with both of the metal plate and the electronic part. Accordingly, a heat radiating property of the electronic apparatus is increased.
申请公布号 US6744135(B2) 申请公布日期 2004.06.01
申请号 US20020147073 申请日期 2002.05.17
申请人 HITACHI, LTD. 发明人 HASEBE TAKEHIKO;YOKOZUKA TAKEHIDE;USHIFUSA NOBUYUKI;HARADA MASAHIDE;MATSUZAKI EIJI;HOZOJI HIROSHI
分类号 H01L23/367;H01L23/498;H05K1/02;H05K1/05;H05K3/46;(IPC1-7):H01L23/34 主分类号 H01L23/367
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