发明名称 |
Substrate processing device, substrate conveying device, and substrate processing method |
摘要 |
An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.
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申请公布号 |
US6742977(B1) |
申请公布日期 |
2004.06.01 |
申请号 |
US20000503916 |
申请日期 |
2000.02.15 |
申请人 |
KOKUSAI ELECTRIC CO., LTD. |
发明人 |
OKAYAMA SATOHIRO;KANAZAWA MOTOICHI;ISHIDA TAKESHIGE;TAKEDA TOMOHIKO;AKITA YUKIO;ICHIMURA SATORU;SUZUKI KAZUNORI;YOSHINO TERUO;AKAO TOKUNOBU;NAKAYAMA YASUNOBU |
分类号 |
H01L21/302;H01L21/3065;H01L21/677;H01L21/687;(IPC1-7):H01L21/68 |
主分类号 |
H01L21/302 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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