发明名称 Substrate processing device, substrate conveying device, and substrate processing method
摘要 An unprocessed substrate is conveyed to a film-processing chamber at the same time a processed substrate is conveyed to a substrate preparation chamber, reducing the substrate processing cycle, thereby increasing the yield per unit time. The substrate preparation chamber has a two-tiered structure for receiving processed substrates and unprocessed substrates. A two-tiered transfer robot allows the substrates to be removed or placed into the preparation and process chambers at the same time, thus decreasing the cycle time for processing a substrate.
申请公布号 US6742977(B1) 申请公布日期 2004.06.01
申请号 US20000503916 申请日期 2000.02.15
申请人 KOKUSAI ELECTRIC CO., LTD. 发明人 OKAYAMA SATOHIRO;KANAZAWA MOTOICHI;ISHIDA TAKESHIGE;TAKEDA TOMOHIKO;AKITA YUKIO;ICHIMURA SATORU;SUZUKI KAZUNORI;YOSHINO TERUO;AKAO TOKUNOBU;NAKAYAMA YASUNOBU
分类号 H01L21/302;H01L21/3065;H01L21/677;H01L21/687;(IPC1-7):H01L21/68 主分类号 H01L21/302
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