发明名称 WAFERIZED POWER CONNECTOR.
摘要 <p>An interconnect system for printed circuit boards. The interconnect system includes signal wafers that carry high speed signals between printed circuit boards. The interconnect system also includes power modules assembled from wafers. The power modules are compact, easy to manufacture and easily integrate with the signal contact wafers to provide a single connector.</p>
申请公布号 MXPA03006691(A) 申请公布日期 2004.05.31
申请号 MX2003PA06691 申请日期 2002.01.23
申请人 TERADYNE, INC. 发明人 ALLAN L. ASTBURY JR.
分类号 H01R12/00;H01R12/50;H01R12/70;H01R13/24;H01R13/514;(IPC1-7):H01R12/16 主分类号 H01R12/00
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