| 摘要 |
A THERMOSETTING PRESSURE-SENSITIVE ADHESIVE WHICH CAN OBTAIN THE HIGH RATE OF POLYMERIZATION WITHOUT A DECREASE IN THE MOLECULAR WEIGHT BY PHOTOPOLYMERIZATION, THEREBY SHOW THE TACKINESS AT ORDINARY TEMPERATURES TO PERMIT EASY TEMPORARY ADHESION TO AN ADHEREND, CAN BE CURED BY HEATING FOR A SHORT PERIODOF TIME TO EXHIBIT STRONG ADHESIVE STRENGTH AND HIGH HEAT RESISTANCE, AND IS EXCELLENT IN STORAGE STABILITY BEFORE HEATING, COMPRISING A PHOTOPOLYMERIZED PRODUCT OF A COMPOSITION COMPRISING A) 100 PARTS BY WEIGHT OF A MONOMER MIXTURE COMPRISING 70TO 99BY WEIGHT OF AN ALKYL (METH) ACRYLATE WHOSE ALKYL GROUP HAS 2 TO14 CARBON ATOMS ON AVERAGE, AND 1TO 30BY WEIGHT OF A MONOETHYLENIC UNSATURATED ACID COPOLYMERIZABLE THEREWITH BASED ON THE MONOMER MIXTURE, B) 0.01 PART TO 20 PARTS BY WEIGHT OF A CLEAVAGE TYPE PHOTOPOLYMERIZATION INITIATOR HAVING 3 OR MORE PEROXIDE GROUPS IN ITS ONE MOLECULE, C) 5 PARTS TO 30 PARTS BYWEIGHT OF AN EPOXY RESIN, AND NOT SUBSTANTIALLY CONTAINING A CURING AGENT FOR THE EPOXY RESIN AS INGREDIENT (C).
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