发明名称 PACKAGE FOR HOUSING SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To solve the problem wherein an impedance is reduced at a joint between a wiring conductor on a circuit board and the center conductor of a coaxial connector, the reflection loss of high-frequency signals grows large, and a semiconductor device is apt to deteriorate its operating properties. SOLUTION: A cutout is provided to a part of the inner grounding conductor 2' of an insulating board 2 of a circuit board below a part of the center conductor 7c of the coaxial connector 7 connected to the wiring conductor 2a on the circuit board, and the length of a part of the center conductor 7c protruding into a frame 6 from the insulator 7b is set 1/4 or below as long as the wavelength of high-frequency signals. An impedance can be effectively restrained from varying at the joint between the wiring conductor 2a and the center conductor 7c. A resonance hardly occurs inside a part of the center conductor 7c protruding from the insulator 7b, so that the reflection loss of high-frequency signals can be much reduced, and a semiconductor device such as an optical semiconductor device 8 or the like can be improved in operation properties. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004152826(A) 申请公布日期 2004.05.27
申请号 JP20020313790 申请日期 2002.10.29
申请人 KYOCERA CORP 发明人 SAWA YOSHINOBU
分类号 H01L23/12;H01L23/02;H01L31/10;H01S5/042;(IPC1-7):H01L23/02 主分类号 H01L23/12
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