| 主权项 |
1. A resin composition for a printed wiring board comprising:
a cyanate compound (A) represented by following general formula (1); and an epoxy resin (B),wherein Ar1 represents an aryl group, Ar2 each independently represents a divalent substituent selected from the group consisting of a phenylene group, a naphthylene group, and a biphenylene group, Ar3 each independently represents a p+1-valent substituent selected from the group consisting of a p+1-valent phenyl group, a p+1-valent naphthyl group, and a p+1-valent biphenyl group, R1 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, and an aryl group, R2 each independently represents a monovalent substituent selected from the group consisting of a hydrogen atom, an alkyl group, an aryl group, and a cyanato group n represents number of cyanato groups bonded to Ar1 and is an integer of 1 to 3, m represents number of R1 bonded to Ar1, n+m+2 is equal to or less than number of possible bonds to Ar1, p represents number of R2 bonded to Ar3 and is an integer of 1 to 9, x and y represent a ratio of repeating units, x is 1, whereas y is 0.25 to 2.0, and the repeating units for x and y may each be continuously arranged or may be alternately or randomly arranged with each other. |
