A HOUSING FOR ELECTRONIC CIRCUITS AND COMPONENTS

摘要

The invention relates to a heat dissipating internally fan-less housing (20) for electronic circuits and components (28). The housing comprises an assembly of two container (10) parts comprising heat-sink fins (12). Each part has a substantially diagonal (14) shaped profile. In the housing a circuit-board (29) is mounted along the diagonal (14) profile thus providing that the long-side ends of the circuit-board (29) on each side of the board are covered by a greater mass of heat-sink fins (12) compared to a horizontally mounted circuit board for a better cooling of components.