| 摘要 |
PROBLEM TO BE SOLVED: To provide a wafer supporting member that can improve the temperature uniformity and temperature responsiveness of wafers with respect to a wafer heating device. SOLUTION: The wafer supporting member is provided with a belt-like resistance heating element in a plate-shaped ceramic material, and a placing surface for placing a wafer on one main surface of the ceramic material. The member has a power feeding section which supplies electric power to the resistance heating element and a metallic case surrounding the power feeding section. The outermost resistance heating element zone is provided with an arcuate pattern which is in contact with the circumscribed circle of the outermost zone, and a bent pattern continuing from the circular-arcuate pattern. The interval between blank zones partially existing in the circumscribed circle and containing no arcuate pattern is made smaller than the difference between the diameters of the ceramic material and circumscribed circle, and the belt width of the belt-like resistance heating element is adjusted to 0.5-5 mm. In addition, the radius of curvature of the bent pattern is made 0.2 to 5 times broader than the belt width. COPYRIGHT: (C)2004,JPO
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