| 摘要 |
PURPOSE: A stack method of a semiconductor package is provided to be capable of reducing the length of a bonding wire for preventing the generation of short and easily loading a heat spreader at the backside of an exposed semiconductor chip. CONSTITUTION: The first and second semiconductor chip(20,50) having the first and second center pads(22,52) are prepared. The first and second board(10,40) having the first and second bonding portions(12,42) are prepared. A bonding process is carried out on the predetermined surface of the first semiconductor chip. The first bonding wire(2) is formed for connecting the first center pad with the first bonding portion. A bonding process is carried out on the predetermined surface of the second semiconductor chip. The second bonding wire(4) is formed for connecting the second center pad with the second bonding portion. The first and second semiconductor package are completed by forming the first and second molding part(5,6) for enclosing the first and second bonding wire, respectively. The second semiconductor package is stacked on the first semiconductor package. |
