发明名称 THERMOELECTRIC MODULE
摘要 PROBLEM TO BE SOLVED: To provide a thermoelectric module that can be connected to a curved surface of a larger curvature. SOLUTION: This thermoelectric module 6 is composed of a pair of substrates 7, a plurality of thermoelectric elements 2 disposed between the substrates 7, and electrodes 3 which are provided on the substrates 7 at intervals and connect the thermoelectric elements 2 to each other. Since loosened portions 8 are provided at least on the portions of the substrates 7 where the electrodes 3 are not provided, the substrates 7 extend and become connectable to a curved surface having a larger curvature. Since contracting stresses are small, the peeling of the thermoelectric elements 2 and electrodes 3 can be prevented. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004153128(A) 申请公布日期 2004.05.27
申请号 JP20020318198 申请日期 2002.10.31
申请人 MATSUSHITA REFRIG CO LTD 发明人 SHIBAYAMA TAKAHITO;TANIGUCHI MITSUNORI
分类号 F25B21/02;H01L23/38;H01L35/32;H01L35/34;H02N11/00;(IPC1-7):H01L35/32 主分类号 F25B21/02
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