| 摘要 |
An IC package for a multi-chip module includes a substrate, a plurality of chips mounted on the substrate, and an encapsultant sealing the chips on the substrate. The IC package is characterized in that at least a thermal bridge is constructed with the encapsultant and each of the thermal bridge is used to bridge at least two chips. By providing the thermal bridge, heat transfer between chips can be upgraded and thereby overall heat-spreading effect and heat dissipation of the multi-chip module can be enhanced. |
