| 摘要 |
PROBLEM TO BE SOLVED: To provide a package for semiconductor element housing which can reduce return loss of a high frequency signal and is excellent in transmission characteristic of a high frequency signal. SOLUTION: The package for semiconductor element housing is provided with base substance 1 which has a mounting part 1a of a semiconductor element 5 on an upper side main surface; a frame member 2 which is bonded on the upper side main surface so as to surround the mounting part 1a, and in which an attaching part 2a of a holding member 11 of a coaxial connector 3 which part 2a is constituted of a penetrating hole or a notched part is arranged at a side part; the holding member 11 which is attached on the attaching part, and in which an insertion hole 11b of the coaxial connector 3 is formed; the coaxial connector 3 which is inserted in the insertion hole 11b; and a circuit board 6 which is arranged on an upper surface of a shelf part 11a installed at a portion below the penetrating hole 2a or the notched part inside the frame member 2, and in which a line conductor 6a is formed. In the line conductor 6a, a central conductor is electrically connected to an upper surface of an insulating substrate, and a semiconductor element 5 is electrically connected via a bonding wire 7. The length of the bonding wire 7 is 0.1-1 mm. COPYRIGHT: (C)2004,JPO
|
