发明名称 |
Device and method for forming bump |
摘要 |
A preheat device is installed, thereby executing before forming bumps to electrode parts a pre formation temperature control for bonding promotion to promote bonding between the electrode parts and the bumps during a bump formation. Metal particles of the electrode parts can be changed to an appropriate state before the bump formation. Phenomenally, a bonding state between the electrode parts and the bumps can be improved as compared with the conventional art. In a further arrangement of the present invention, semiconductor components with bumps formed can be heated under a bonding strength improvement condition by a bonding stage through controlling the heating by a controller. |
申请公布号 |
US2004102030(A1) |
申请公布日期 |
2004.05.27 |
申请号 |
US20030332026 |
申请日期 |
2003.01.02 |
申请人 |
NARITA SHORIKI;YOSHIDA KOICHI;IKEYA MASAHIKO;MAE TAKAHARU;KANAYAMA SHINJI;IMANISHI MAKOTO;HIGASHI KAZUSHI;FUKUMOTO KENJI;WADA HIROSHI |
发明人 |
NARITA SHORIKI;YOSHIDA KOICHI;IKEYA MASAHIKO;MAE TAKAHARU;KANAYAMA SHINJI;IMANISHI MAKOTO;HIGASHI KAZUSHI;FUKUMOTO KENJI;WADA HIROSHI |
分类号 |
H05K3/34;B23K20/00;H01L21/00;H01L21/60;(IPC1-7):H01L21/44;H01R43/02 |
主分类号 |
H05K3/34 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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