MULTILAYER WIRING SUBSTRATE, BASE MATERIAL THEREFOR AND THEIR MANUFACTURING METHODS

摘要

PROBLEM TO BE SOLVED: To avoid a fault at part mounting by the presence of a resin component in a conductive paste on a surface of a conductive layer (copper foil) which is perforated. SOLUTION: A metal layer 16 coating a conductive resin composition 15 exposed to an opening of a conductive layer 12 side of a through hole 14 is formed on a surface of the layer 12. COPYRIGHT: (C)2004,JPO