| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component packaging module in which stress generation in a soldered portion is suppressed. SOLUTION: A circuit board 2 includes an insertion hole 21 and a lead hole 22. A transistor 3 comprises a main body 31 and an external lead 32. The external lead 32 includes an apical portion 321, a middle portion 322 and a penetration portion 323 in this order from an apical end. A first soldering portion 4 connects electrically the lead hole 22 and the apical portion 321, while a second soldering portion 5 fixes mechanically the penetration portion 323 and the circuit board 2. The second soldering portion 5 fixing the penetration portion 323 and the circuit board 2 absorbs vibration transmitted to the external lead, preventing the vibration from transmitting to the first soldering portion 4 that connects electrically the apical portion 321 and the lead hole 22. Consequently, stress generated in the first soldering portion 4 is small to be able to prevent conductive fault caused by cracks. COPYRIGHT: (C)2004,JPO
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