CIRCUIT WIRING BOARD, MANUFACTURING METHOD THEREOF, AND SEALING RESIN COMPOSITION

摘要

PROBLEM TO BE SOLVED: To reduce the cost by simplifying manufacturing processes for a circuit wiring board employing a sealing resin composition with a flux function.

SOLUTION: A sealing resin is used whose curing acceleration temperature is higher than a preliminary heating temperature and equal to or lower than a main heating temperature. Soldering between a first electrode and a first circuit component, soldering between a second electrode and a second circuit component, and curing of the sealing resin, are performed at once.

COPYRIGHT: (C)2004,JPO