| 摘要 |
PROBLEM TO BE SOLVED: To provide wafer prober device that has no warp, even if a probe card is pressed, can effectively protect damages and measurement errors of a silicon wafer, and is light-weight and superior in a temperature rise and fall characteristic. SOLUTION: This is wafer prober device composed of a ceramic substrate on whose surface a conductor layer is formed and its support container, and a support column is built up in the container. Wafer prober device can be obtained, even when a probe card is pressed, there occurs no warp, and a damage and measurement error of the silicon wafer can effectively protected, and further, which is light-weight, and is superior in the temperature rise and fall characteristics. COPYRIGHT: (C)2004,JPO |
