发明名称 FILM THICKNESS MEASURING METHOD FOR GROOVE SIDEWALL AND ITS DEVICE
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a nondestructive inspection method capable of measuring the film thickness of a groove part sidewall of a fine structure, and a device for realizing the method. <P>SOLUTION: In this sidewall film thickness measuring method and its device, a focusing charged particle beam capable of being specifically irradiated onto the groove part sidewall of the fine structure is used as a primary beam, or otherwise a wide charged particle beam to be irradiated to a specific wide region including the groove part sidewall of the aimed fine structure is used as the primary beam. A fluorescent X-ray emitted from the sample surface is detected, and the film thickness of a primary beam irradiation part or the average film thickness of the groove part sidewall is measured by being equipped with an energy analytical means or a wavelength analytical means. <P>COPYRIGHT: (C)2004,JPO</p>
申请公布号 JP2004151004(A) 申请公布日期 2004.05.27
申请号 JP20020318103 申请日期 2002.10.31
申请人 SEIKO INSTRUMENTS INC 发明人 SASAYAMA NORIO;FUJII TOSHIAKI;TAKAHASHI MASANORI
分类号 G01N23/225;(IPC1-7):G01N23/225 主分类号 G01N23/225
代理机构 代理人
主权项
地址