发明名称 |
CERAMIC JOINT BODY |
摘要 |
An object of the present invention is to provide a ceramic bonded body comprising a ceramic substrate and a ceramic body such as a cylindrical body firmly bonded to each other and excellent in corrosion resistance in the ceramic substrate for the use for a semiconductor product producing/examining step. The ceramic bonded body according to the present invention comprises: a ceramic substrate in which a conductor is provided; and a ceramic body bonded to a bottom face of the ceramic substrate The ceramic bondedbody has a region, where no conductor is formed, in at least a part of a region above a bonding interface between the ceramic substrate and the ceramic body. <IMAGE> |
申请公布号 |
EP1422754(A1) |
申请公布日期 |
2004.05.26 |
申请号 |
EP20020758835 |
申请日期 |
2002.08.12 |
申请人 |
IBIDEN CO., LTD. |
发明人 |
ITO, YASUTAKA;OHKURA, KAZUTERU |
分类号 |
C04B35/10;C04B35/565;C04B35/581;C04B35/645;C04B37/00;H01L21/00;H01L21/683;(IPC1-7):H01L21/68;H05B3/04;H05B3/10;H01L21/02;H05B3/06 |
主分类号 |
C04B35/10 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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