POWER ELECTRONICS COMPONENT

摘要

The invention relates to a power electronics component that comprises a planar ceramics substrate ( 2 ) on whose one face condutor tracks ( 6 ), applied in thick-film technique, are disposed for electrically connecting electrical power components ( 7 ) of a circuit that are also disposed on the ceramics substrate ( 2 ). The ceramics substrate ( 2 ), with its other face, is brazed onto a metal a metal support element ( 1 ) that serves as a heat spreader. The support element ( 1 ) is linked with a thermoconducting housing part housing that accommodates the support element ( 1 ) in a thermoconductive manner. On the face of the support element ( 1 ) facing away from the ceramics substrate ( 2 ), approximately opposite the ceramics substrate ( 2 ), a second ceramics substrate ( 4 ) is brazed onto the ceramics substrate ( 2 ) that carries the circuit and has approximately the same dimensions.