| 摘要 |
A wafer cleaning apparatus includes a wafer supporting device for supporting a wafer to be cleaned, and sponges for cleaning the wafer. The sponges are arranged in contact with either surface of the wafer and are rotated along rotational axes that are parallel to the wafer. A sponge positioning device pushes the sponges against the wafer. A wafer rotation drive is adapted to rotate the wafer at a constant speed, and a sponge rotation drive system is adapted to rotate the sponges at a constant speed. A closed loop controller receives motor current signals from the wafer rotation drive and/or the sponge rotation drive system, and the closed loop controller provides an adjustment signal to the sponge positioning device. The adjustment signal is for adjusting the friction between the sponges and the wafer.
|
