| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To develop a chip capacitor assuring a static capacitance similar to that of the existing chip capacitor while it is a laminated thin ceramic capacitor suitable for use as a capacitor built in between interlayer insulating layers in a multilayer printed wiring board, and to provide an element-containing board with the thin chip capacitor built therein and a method for manufacturing the same. <P>SOLUTION: The built-in chip capacitor for a printed wiring board is thinner than an interlayer insulating layer. More specifically, its thickness t falls in a range covered by 10μm≤t≤100μm, its length L in a range covered by 1mm≤L≤10mm and its width W in a range covered by 1mm≤W≤10mm. Electrodes are provided on its side faces for connection to the outside. The thickness t<SB>z</SB>of an insulating layer that contains the chip capacitor is in a range covered by t+10μm≤t<SB>z</SB>≤t+50μm relative to the thickness t of the chip capacitor. For the element-containing wiring board, insulating layers are formed by thermocuring a liquid insulating resin. The method results in a thin chip capacitor assuring a static capacitance similar to that of the existing chip capacitor despite its thinness. <P>COPYRIGHT: (C)2004,JPO</p> |
