发明名称 ELECTRONIC MEMBER AND METHOD OF MANUFACTURING THE SAME, AND SEMICONDUCTOR DEVICE
摘要 PROBLEM TO BE SOLVED: To provide an electronic member having higher insulation reliability under the condition that a plurality of metal bodies forming circuits become conductive through a bonding agent layer, even when the member is used in the high-temperature and low-humidity atmosphere and high-temperature and high-humidity atmosphere. SOLUTION: In the electronic member 1, the circuit 30 with patterned metal body 31 is fixed to an insulating base material 10 via the bonding agent layer 20, and this bonding agent layer 20 placed in contact with the adjacent metal body 20 is divided with each other. COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146526(A) 申请公布日期 2004.05.20
申请号 JP20020308684 申请日期 2002.10.23
申请人 TOMOEGAWA PAPER CO LTD 发明人 HASHIMOTO TAKESHI
分类号 H01L21/60;H01L23/495;H01L23/538;H05K1/00;H05K3/00;H05K3/20;H05K3/22;H05K3/38;(IPC1-7):H01L21/60 主分类号 H01L21/60
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