| 摘要 |
PURPOSE: A hybrid IC(Integrated Circuit) is provided to be capable of reducing the fabrication cost and time and easily releasing heat. CONSTITUTION: A hybrid IC includes a substrate(212). At this time, the substrate has a conductive pattern(214) and a plurality of substrate through holes(212a) for flowing air. The hybrid IC further includes an electric device(215) loaded on one surface of the substrate for being connected with the conductive pattern and a heat sink(211) attached on the other surface of the substrate. The heat sink has a plurality of heat sink through holes(211a) connected through the substrate through holes, respectively. Preferably, the substrate through holes are formed on one surface of the substrate. Preferably, the substrate through holes are non-linearly arrayed on the substrate.
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