COPPER COMPLEXES AND THEIR USE AS WOOD PRESERVATIVES
摘要
This invention relates to copper complexes that significantly reduce the decay of wood, cellulose, hemicellulose, and lignin caused by fungi. A process for treating such materials with these copper-containing anti-fungal agents is also disclosed.
申请公布号
WO2004041491(A2)
申请公布日期
2004.05.21
申请号
WO2003US35174
申请日期
2003.10.31
申请人
E.I. DU PONT DE NEMOURS AND COMPANY;ANDERSON, ALBERT, GORDON;SCIALDONE, MARK, A.