| 摘要 |
PROBLEM TO BE SOLVED: To solve a problem that a residue of a photosensitive resin film remains on an IDT electrode and a connection pad and that an electric characteristic of a SAW chip or a SAW device is deteriorated when a dam surrounding the IDT electrode is formed on a lower face of the SAW chip by photoetching technology for preventing a defect that liquid-like resin applied to cover the SAW chip adheres to the IDT electrode. SOLUTION: A manufacturing method is provided with a process for forming an IDT electrode pattern 17 on one face of a piezoelectric substrate 19, a process for covering the IDT electrode pattern in a first photoresist film 40 for IDT electrode protection, which can completely be removed by organic solvent and photoresist stripping agent, a process for covering a second photoresist 45 constituting the circular dam 18 of a piezoelectric substrate face comprising the first photoresist film, an exposure development process for removing a second photoresist from which a part constituting the circular dam is removed and a process for removing the first photoresist film with the residue of the second photoresist. COPYRIGHT: (C)2004,JPO
|
