发明名称 PLASMA PROCESSING METHOD AND PLASMA PROCESSING APPARATUS
摘要 <P>PROBLEM TO BE SOLVED: To provide a plasma processing method and a plasma processing apparatus, capable of suppressing oxidation of an object to be treated during plasma processing and improving the processing rate, without increasing the RF power. <P>SOLUTION: Helium, supplied from a helium cylinder 1, is made to come into direct contact with pure water 5 in a steam mixer 3 and is supplied to a plasma processing unit 4. In the plasma processing unit 4, plasma is generated by the application of a high-frequency voltage from a high-frequency power supply 6, and organic substances on a work 43 are removed by the oxidizing action of the oxygen and the reducing action of hydrogen generated by the activated water. <P>COPYRIGHT: (C)2004,JPO
申请公布号 JP2004146837(A) 申请公布日期 2004.05.20
申请号 JP20030364562 申请日期 2003.10.24
申请人 SEIKO EPSON CORP 发明人 KURASHINA OSAMU;MIYAGAWA TAKUYA
分类号 H05H1/24;H01L21/304;H01L21/3065;H01L21/56 主分类号 H05H1/24
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