Chip scale package with flip chip interconnect

摘要

A flip chip package is formed by a solid-state bond technique for connecting the input/output pads on the integrated circuit chip and the package substrate. The solid-state bond technique involves a direct mating of metal surfaces, and does not employ any particulate conductive material nor any melting or flow of any interconnecting material. Accordingly the connections can be formed at very fine geometries. In another aspect, the space between the surface of the integrated circuit chip and the subjacent surface of the package substrate is filled with a patterned adhesive structure, which consists of one or more adhesive materials that are deployed in a specified pattern in relation to the positions of the second level interconnections between the package and the printed circuit board.