发明名称 |
Probe applied to semiconductor package test and method for testing semiconductor package |
摘要 |
A probe used for testing on a semiconductor package is provided which is capable of reducing scratching of a solder ball, sticking of solder to a contact terminal, and damage to the contact terminal. A diameter of an end portion of the contact terminal of a probe is set to be almost the same as that of a solder ball. The end portion is provided with a semispherical concave portion to be contacted with the solder ball and a plurality of guiding grooves formed from a center of the concave portion in a direction of a diameter and used to guide solder separated from the solder ball and stuck to the concave portion.
|
申请公布号 |
US6737878(B2) |
申请公布日期 |
2004.05.18 |
申请号 |
US20020303870 |
申请日期 |
2002.11.26 |
申请人 |
OKI ELECTRIC INDUSTRY CO., LTD. |
发明人 |
KAGAMI SUMIO |
分类号 |
G01R31/26;G01R1/067;G01R1/073;H01R13/24;H01R33/76;(IPC1-7):G01R31/02 |
主分类号 |
G01R31/26 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|