MOLDING RESIN SEALED POWER SEMICONDUCTOR DEVICE AND MANUFACTURING METHOD THEREFOR, CONCERNED WITH ACCUMULATING RESIN LAYER SO AS TO BE INTEGRATED WITH METAL LAYER

摘要

PURPOSE: A molding resin sealed power semiconductor device and a manufacturing method therefor are provided to improve the reliability of an insulating resin layer by accumulating the resin layer so as to be integrated with a metal layer. CONSTITUTION: A metal plate includes a main surface, a bottom surface opposed to the main surface in a direction of thickness and side surfaces disposed between the main and bottom surfaces. The metal plate operates as a heat sink. A first lead frame(1A) includes a first inner lead portion and a first outer lead portion continuously connected to the first inner lead portion. The first lead portion includes a tip portion directly fixed onto a peripheral portion of the main surface. A second lead frame(1B) includes a second inner lead portion and a second outer lead portion. A power semiconductor chip(2) includes a lower surface, an upper surface, and side surfaces. An insulating resin layer(6) includes an upper surface fixed onto the bottom surface of a metal plate.