| 摘要 |
PROBLEM TO BE SOLVED: To provide a reflow soldering improving method capable of preventing soldering paste from getting deficient due to being pushed out by leads and omitting a correcting process without paying attention to printing of the soldering paste and insertion of the leads. SOLUTION: A block is arranged on a surface opposite to a compomponent to be inserted 50 of a printed-circuit board 40 and the component leads 51 are inserted into a through-hole 41 that has been supplied with the soldering paste 30. A paste holding portion 11 holds the soldering paste 30 pushed out by the component leads 51, so that the lead holding portion 13 houses the component leads 51. Existence of a lead guide 12 causes the component leads 51 to be easily guided into the lead holding portion 13. A lower portion 20 of the block is detachable for cleaning the lead holding portion 13, while an inner surface of the block is subjected to surface treatment for preventing soldering paste from attaching thereto when detached from the printed-circuit board 40. COPYRIGHT: (C)2004,JPO
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