发明名称 Photomask manufacturing method, photomask manufactured by said manufacturing method, and semiconductor device method using said photomask
摘要 Disclosed is a method of manufacturing a photomask, comprising calculating a pattern area ratio, which is a ratio of the light transmitting pattern portion or the light shielding pattern portion to an area of the photomask from the design data of a given layout pattern of the photomask, and a pattern density, which is a ratio of the light transmitting pattern portion or light shielding pattern portion within the region to the area of the region extracted from the given layout pattern, estimating from the calculated pattern area ratio and the pattern density the size of a pattern formed in the case where the pattern is formed on the photomask by using the design data of the given layout pattern, and imparting the amount of correction to the design data of the given layout pattern based on the estimated pattern size.
申请公布号 US2004091797(A1) 申请公布日期 2004.05.13
申请号 US20030698356 申请日期 2003.11.03
申请人 KABUSHIKI KAISHA TOSHIBA;DAI NIPPON PRINTING CO., LTD. 发明人 INOUE MARI
分类号 G03F1/08;G03F1/14;G03F1/36;G03F1/68;G03F1/70;H01L21/027;(IPC1-7):G03F9/00;G03C5/04 主分类号 G03F1/08
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